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USB 3.0 AM SOLDER
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MATERIALS:
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1.1-Insulator:High temperature
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thermoplastic with g.fUL94v-0
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1.2-Contact:Copper alloy,t=0.25mm
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1 3-SHELL: Steel ,t=0.35mm
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FINISHES:
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USB 3.0
AM SMT
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MATERIALS:
|

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1.1-Insulator:High temperature
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thermoplastic with g.fUL94v-0
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1.2-Contact:Copper alloy,t=0.20mm
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1.3- SHELL: Steel ,t=0.35mm
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FINISHES:
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USB
3.0 AF SOLDER
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MATERIALS:
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1.1-Insulator:High temperature
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thermoplastic with g.fUL94v-0
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|

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1.2-Contact:Copper alloy,t=0.20mm
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1.3-Shell: Copper alloy,t=0.40mm
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FINISHES:
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USB 3.0
AF RIGHT ANGLE
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MATERIALS:
|

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1.1-Insulator:High temperature
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|
|
|
|
thermoplastic with g.fUL94v-0
|
|

|
1.2-Contact:Copper alloy,t=0.25mm
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|

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1.3-Shell: Copper alloy,t=0.40mm
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FINISHES:
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USB 3.0
AF RIGHT ANGLE(REVERSE)
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MATERIALS:
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1.1-Insulator:High temperature
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|
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thermoplastic with g.fUL94v-0
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|

|
1.2-Contact:Copper alloy,t=0.25mm
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|

|
1.3-Shell: Copper alloy,t=0.40mm
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|
|
|
|
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FINISHES:
|
|
|

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USB 3.0
BM SOLDER
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MATERIALS:
|
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1.1-Insulator:High temperature
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thermoplastic with g.fUL94v-0
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|
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1.2-Contact:Phosphor bronze,t=0.40mm
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1.3-Shell:Spcc,t=0.30mm
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FINISHES:
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|

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USB 3.0
BF RIGHT ANGLE
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MATERIALS:
|

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1.1-Insulator:High temperature
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|
|
|
|
thermoplastic with g.fUL94v-0
|
|

|
1.2-Contact:Copper alloy,t=0.20mm
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|

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1.3-Shell: Copper alloy,t=0.30mm
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FINISHES:
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|

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USB 3.0
MICRO BM SOLDER
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MATERIALS:
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1.1-Insulator:High temperature
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|
|
|
|
thermoplastic with g.fUL94v-0
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|

|
1.2-Contact:Copper alloy,t=0.20mm
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|

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1.3-Shell: Copper alloy,t=0.30mm
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|
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FINISHES:
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|
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USB 3.0
MICRO BF SMT
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MATERIALS:
|

|
1.1-Insulator:High temperature
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|
|
|
|
thermoplastic with g.fUL94v-0
|
|

|
1.2-Contact:Copper alloy,t=0.20mm
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|

|
1.3-Shell:Spcc,t=0.30mm
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|
|
|
|
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FINISHES:
|
|
|
|
|
|
MATERIALS:
|

|
1.1-Insulator:High temperature
|
|
|
|
|
thermoplastic with g.fUL94v-0
|
|

|
1.2-Contact:Copper alloy,t=0.20mm
|
|

|
1.3-Shell:Spcc,t=0.30mm
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|
|
|
|
|
FINISHES:
|
|
|
|
|
|
MATERIALS:
|

|
1.1-Insulator:High temperature
|
|
|
|
|
thermoplastic with g.fUL94v-0
|
|

|
1.2-Contact:Copper alloy,t=0.20mm
|
|

|
1.3-Shell:Spcc,t=0.30mm
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|
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FINISHES:
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